英语翻译Voids in the encapsulant are a potential problem,these can originate during dispense,die placement,or reflow,but can be eliminated through proper materials selection,board preparation dispense parameters and reflow condition.
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![英语翻译Voids in the encapsulant are a potential problem,these can originate during dispense,die placement,or reflow,but can be eliminated through proper materials selection,board preparation dispense parameters and reflow condition.](/uploads/image/z/15186010-58-0.jpg?t=%E8%8B%B1%E8%AF%AD%E7%BF%BB%E8%AF%91Voids+in+the+encapsulant+are+a+potential+problem%2Cthese+can+originate+during+dispense%2Cdie+placement%2Cor+reflow%2Cbut+can+be+eliminated+through+proper+materials+selection%2Cboard+preparation+dispense+parameters+and+reflow+condition.)
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