英语翻译The high stress region causesthe BGA interconnects located within the region to mechanically fail before BGA interconnects outsideof this region due to thermally induced stress.
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英语翻译The high stress region causesthe BGA interconnects located within the region to mechanically fail before BGA interconnects outsideof this region due to thermally induced stress.
英语翻译
The high stress region causesthe BGA interconnects located within the region to mechanically fail before BGA interconnects outsideof this region due to thermally induced stress.
英语翻译The high stress region causesthe BGA interconnects located within the region to mechanically fail before BGA interconnects outsideof this region due to thermally induced stress.
由于热诱导应力原因,该高应力区使得位于区域内的BGA互连在该地区外的BGA互连之前出现机械破损/损坏/故障/.
高应力区使BGA互连位于区域内的机械在BGA互连在这一地区由于热诱导应力失败。
高应力区causesthe BGA互联位于该地区机械失败走出这个地区之前BGA互联由于热诱导应力。
BGA的全称是Ball Grid Array(球栅阵列结构的PCB),它是集成电路采用有机载板的一种封装法。
位于高应力区域的BGA互连板,由于承受热诱导应力而导致比位于压力区域外的BGA互连板较早发生机械故障。