SMT电子焊接行业1.工艺描述,先在陶瓷基板上置锡球,然后在一个软板上刷胶,然后贴上置球后的陶瓷基板.刷胶的目的是,正好包围住锡球.2.每块陶瓷基板上置锡球后的高度不太一致,0.08mm~0.24mm.刷
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![SMT电子焊接行业1.工艺描述,先在陶瓷基板上置锡球,然后在一个软板上刷胶,然后贴上置球后的陶瓷基板.刷胶的目的是,正好包围住锡球.2.每块陶瓷基板上置锡球后的高度不太一致,0.08mm~0.24mm.刷](/uploads/image/z/6514473-57-3.jpg?t=SMT%E7%94%B5%E5%AD%90%E7%84%8A%E6%8E%A5%E8%A1%8C%E4%B8%9A1.%E5%B7%A5%E8%89%BA%E6%8F%8F%E8%BF%B0%2C%E5%85%88%E5%9C%A8%E9%99%B6%E7%93%B7%E5%9F%BA%E6%9D%BF%E4%B8%8A%E7%BD%AE%E9%94%A1%E7%90%83%2C%E7%84%B6%E5%90%8E%E5%9C%A8%E4%B8%80%E4%B8%AA%E8%BD%AF%E6%9D%BF%E4%B8%8A%E5%88%B7%E8%83%B6%2C%E7%84%B6%E5%90%8E%E8%B4%B4%E4%B8%8A%E7%BD%AE%E7%90%83%E5%90%8E%E7%9A%84%E9%99%B6%E7%93%B7%E5%9F%BA%E6%9D%BF.%E5%88%B7%E8%83%B6%E7%9A%84%E7%9B%AE%E7%9A%84%E6%98%AF%2C%E6%AD%A3%E5%A5%BD%E5%8C%85%E5%9B%B4%E4%BD%8F%E9%94%A1%E7%90%83.2.%E6%AF%8F%E5%9D%97%E9%99%B6%E7%93%B7%E5%9F%BA%E6%9D%BF%E4%B8%8A%E7%BD%AE%E9%94%A1%E7%90%83%E5%90%8E%E7%9A%84%E9%AB%98%E5%BA%A6%E4%B8%8D%E5%A4%AA%E4%B8%80%E8%87%B4%2C0.08mm%7E0.24mm.%E5%88%B7)
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